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		<title>Future on Total Infrared Heating Solutions</title>
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				<title>Radiative Heat Transfer vs Forced Convection in BGA Component Heating</title>
				<link>http://ir-heating-solutions.com/en/posts/radiative-heat-transfer-vs-forced-convection-in-bga-component-heating/</link>
				<pubDate>Wed, 02 Sep 2026 20:32:04 +0800</pubDate>
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				<description>&lt;p&gt;&lt;img src=&#34;http://ir-heating-solutions.com/images/4eb77616b150db7dd148f7ae9e8fb0dc.png&#34; alt=&#34;Radiative Heat Transfer vs Forced Convection in BGA Component Heating&#34;&gt;&lt;/p&gt;&#xA;&lt;h1 id=&#34;why-radiative-heating-just-works-better-for-bga-packaging&#34;&gt;Why Radiative Heating Just Works Better for BGA Packaging&lt;/h1&gt;&#xA;&lt;p&gt;If you’ve ever worked with Ball Grid Array (BGA) components, you know the nightmare of the &amp;ldquo;shadow effect.&amp;rdquo;&#xA;It&amp;rsquo;s basically a game of hide-and-seek. In a standard hot-air oven, the air has to fight its way around the body of the component just to reach those tiny solder balls tucked underneath. If your airflow is off by even a hair, you end up with uneven heating and cold solder joints.&#xA;And that usually means a wasted board and a lot of frustration.&lt;/p&gt;</description>
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